Silicon Wafer Custom Double Side Polished Si Substrate 2‘ 3’ 4‘ 6’

Silicon Wafer Custom Double Side Polished Sic Wafer Substrate 2' 3' 4' 6' 1. what is silicon wafers and it's application

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DESCRIPTION

Basic Info

Model NO.	FW-CRYSTAL
Manufacturing Technology	Optoelectronic Semiconductor
Material	Compound Semiconductor
Type	Intrinsic Semiconductor
Package	SMD
Signal Processing	Analog Digital Composite and Function
Application	LED
Growth Method	CZ and Fz
Orientation	111 or 100
Resistivity	0.0005 to 150
Surface	Double Side Polished or Single Side Polished
Dopant	N Type and P Type
Particles	<30 at 0.3um
Bow	< 30 Um
Ttv	<15 Um
Transport Package	Box
Origin	Jiaozuo Henan
Production Capacity	100, 000PCS/Month

Product Description

Silicon Wafer Custom Double Side Polished Sic Wafer Substrate 2' 3' 4' 6'

1. what is silicon wafers and it's application:
A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives.

Silicon wafer is the most common material and widely used for a varity of high-tech industries, including integrated circuits, detector or sensor device, MEMS fabrication, opto-electronic components, and solar cells.

Silicon wafer is a very thin round disk cut from high-purity silicon. A round silicon ingot is sliced to thicknesses of approximately 1mm. The surfaces of the resulting disk are polished carefully, then it is cleaned, resulting in the completed wafer. Silicon wafers are made from high-purity silicon, and are the material of semiconductor devices. These wafers can also be fabricated with a SEMI notch or one or two SEMI flats.

Product picture

Silicon Wafer Custom Double Side Polished Si Substrate 2‘ 3&rsquor; 4‘ 6&rsquor;

2. Manufacturing a Silicon Wafer
Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method.

Silicon Wafer Custom Double Side Polished Si Substrate 2‘ 3&rsquor; 4‘ 6&rsquor;

3.Equipment we use

Silicon Wafer Custom Double Side Polished Si Substrate 2‘ 3&rsquor; 4‘ 6&rsquor;

4.Spcifications(related products we can supply)

Grow method	CZ or FZ
Diameter	1 to 8 inch
Finish	As cut, lapped, etched, SSP, DSP
Orientation	(100) (111) (110)
Type	N or P
Resistivity	CZ: From 0.0005 to 150 Ωcm FZ: Up to 10 kΩcm